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INTEGRATED CIRCUITS
DATA SHEET
TDA8566TH 2 x 40 W/2 stereo BTL car radio power amplifier with differential inputs and diagnostic outputs
Objective specification File under Integrated Circuits, IC01 2001 Apr 24
Philips Semiconductors
Objective specification
2 x 40 W/2 stereo BTL car radio power amplifier with differential inputs and diagnostic outputs
FEATURES * Differential inputs * Very high Common Mode Rejection Ratio (CMRR) * High common mode input signal handling * Requires very few external components * High output power * 4 and 2 load driving capability * Low offset voltage at output * Fixed gain * Diagnostic facility (distortion, short-circuit and temperature pre-warning) * Good ripple rejection * Mode select switch (operating, mute and standby) * Load dump protection * Short-circuit proof to ground, to VP and across the load QUICK REFERENCE DATA SYMBOL VP IORM Iq(tot) Istb Isw Zi Pout SVRR cs CMRR Gv Vn(o) PARAMETER operating supply voltage repetitive peak output current total quiescent current standby current switch-on current input impedance output power supply voltage ripple rejection channel separation common mode rejection ratio closed loop voltage gain noise output voltage Rs = 0 RL = 4 ; THD = 10% RL = 2 ; THD = 10% Rs = 0 Rs = 10 k CONDITIONS MIN. 6 - - - - 100 - - - - - 25 - GENERAL DESCRIPTION * Thermally protected * Reverse polarity safe
TDA8566TH
* Low power dissipation in any short-circuit condition
* Protected against electrostatic discharge * No switch-on/switch-off plops * Low thermal resistance.
The TDA8566TH is an integrated class-B output amplifier contained in a 20-lead small outline plastic package. The device contains 2 amplifiers in a Bridge-Tied Load (BTL) configuration. The output power is 2 x 25 W in a 4 load or 2 x 40 W in a 2 load. It has a differential input stage and 2 diagnostic outputs. The device is primarily developed for car radio applications.
TYP. 14.4 - 115 0.1 - 120 25 40 60 50 75 26 -
MAX. 18 7.5 - 10 40 - - - - - - 27 120
UNIT V A mA A A k W W dB dB dB dB V
ORDERING INFORMATION TYPE NUMBER TDA8566TH PACKAGE NAME HSOP20 DESCRIPTION plastic, heatsink small outline package; 20 leads; low stand-off height VERSION SOT418-2
2001 Apr 24
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Philips Semiconductors
Objective specification
2 x 40 W/2 stereo BTL car radio power amplifier with differential inputs and diagnostic outputs
BLOCK DIAGRAM
TDA8566TH
VP1
handbook, full pagewidth
VP2 19
IN1+
8 + 9 -
mute switch
12 CM
IN1-
13 2.3 k + - 2.3 k mute switch (9x) CM VA
OUT1+
+ -
15 60 k 60 k 2.3 k + - 2.3 k 4, 5, 6, 7 standby switch (9x) 20 VA
OUT1-
n.c.
MODE
TDA8566TH
Vref SGND 10 1x DIAG mute reference voltage + 3 - 16 2.3 k + - 2.3 k mute switch (9x) CM VA OUT2+ mute switch 1 DIAG VA standby reference voltage mute switch
CLIP
11
CLIP
60 k IN2+ 2
60 k
CM
IN2-
+ -
18 2.3 k + - 2.3 k 17 14 (9x)
MGU358
VA
OUT2-
PGND2
PGND1
Fig.1 Block diagram.
2001 Apr 24
3
Philips Semiconductors
Objective specification
2 x 40 W/2 stereo BTL car radio power amplifier with differential inputs and diagnostic outputs
PINNING SYMBOL DIAG IN2+ IN2- n.c. n.c. n.c. n.c. IN1+ IN1- SGND CLIP VP1 OUT1+ PGND1 OUT1- OUT2+ PGND2 OUT2- VP2 MODE PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 DESCRIPTION short-circuit and temperature pre-warning diagnostic output channel 2 input positive channel 2 input negative not connected not connected not connected not connected channel 1 input positive channel 1 input negative signal ground clip detection output supply voltage 1 channel 1 output positive power ground 1 channel 1 output negative channel 2 output positive power ground 2 channel 2 output negative supply voltage 2 mode select switch input (standby/mute/operating)
OUT1+ 13 VP1 12 CLIP 11
MGU356
TDA8566TH
handbook, halfpage
MODE 20 VP2 19 OUT2- 18 PGND2 17 OUT2+ 16
1 DIAG 2 IN2+ 3 IN2- 4 n.c. 5 n.c.
TDA8566TH
OUT1- 15 PGND1 14 6 n.c. 7 n.c. 8 IN1+ 9 IN1- 10 SGND
Fig.2 Pin configuration.
2001 Apr 24
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Philips Semiconductors
Objective specification
2 x 40 W/2 stereo BTL car radio power amplifier with differential inputs and diagnostic outputs
FUNCTIONAL DESCRIPTION The TDA8566TH contains 2 identical amplifiers and can be used for BTL applications. The gain of each amplifier is fixed at 26 dB. Special features of this device are: 1. Mode select switch 2. Clip detection 3. Short-circuit diagnostic 4. Temperature pre-warning 5. Open-collector diagnostic outputs 6. Differential inputs. Mode select switch (pin MODE) * Standby: low supply current * Mute: input signal suppressed * Operating: normal on condition. Since this pin has a very low input current (<40 A), a low cost supply switch can be applied. To avoid switch-on plops, it is advisable to keep the amplifier in the mute mode for a period of 150 ms (charging the input capacitors at pins IN1+, IN1-, IN2+ and IN2-). This can be realized by using a microcontroller or by using an external timing circuit as illustrated in Fig.7. Clip detection (pin CLIP) When clipping occurs at one or more output stages, the dynamic distortion detector becomes active and pin CLIP goes LOW. This information can be used to drive a sound processor or a DC volume control to attenuate the input signal and so limit the level of distortion. The output level of pin CLIP is independent of the number of channels that are being clipped. The clip detection circuit is disabled in a short-circuit condition, so if a fault condition occurs at the outputs, pin CLIP will remain at a HIGH level. The clip detection waveforms are illustrated in Fig.3.
TDA8566TH
Short-circuit diagnostic (pin DIAG) When a short-circuit occurs at one or more outputs to ground or to the supply voltage, the output stages are switched off until the short-circuit is removed and the device is switched on again (with a delay of approximately 20 ms after the removal of the short-circuit). During this short-circuit condition, pin DIAG is continuously LOW. When a short-circuit occurs across the load of one or both channels, the output stages are switched off for approximately 20 ms. After that time the load condition is checked during approximately 50 s to see whether the short-circuit is still present. Due to this duty cycle of 50 s/20 ms the average current consumption during the short-circuit condition is very low (approximately 40 mA). During this condition, pin DIAG is LOW for 20 ms and HIGH for 50 s; see Fig.4. The power dissipation in any short-circuit condition is very low. Temperature pre-warning (pin DIAG) When the junction temperature (Tvj) reaches 145 C, pin DIAG will become continuously LOW. Open-collector diagnostic outputs Pins DIAG and CLIP are open-collector outputs, therefore more devices can be tied together. Pins DIAG and CLIP can also be tied together. An external pull-up resistor is required. Differential inputs The input stage is a high-impedance fully differential balanced input stage that is also capable of operating in a single-ended mode with one of the inputs capacitively coupled to an audio ground. It should be noted that if a source resistance is added (input voltage dividers) the CMRR degrades to lower values.
MGU357
V handbook, halfpage O (V) 0
VCLIP (V) 0
t (s)
Fig.3 Clip detection waveforms.
2001 Apr 24
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Philips Semiconductors
Objective specification
2 x 40 W/2 stereo BTL car radio power amplifier with differential inputs and diagnostic outputs
TDA8566TH
handbook, full pagewidthcurrent
in output stage
MGU360
short-circuit over the load VDIAG (V) 20 ms
t (s)
t (s) 50 s
Fig.4 Short-circuit diagnostic timing diagram.
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VP PARAMETER supply voltage CONDITIONS operating non-operating load dump protection; during 50 ms; tr 2.5 ms IOSM IORM Tstg Tvj Tamb Vpsc Vrp Ptot non-repetitive peak output current repetitive peak output current storage temperature virtual junction temperature ambient temperature short-circuit safe voltage reverse polarity voltage total power dissipation - - - - - -55 - -40 - - - MIN. MAX. 18 30 45 10 7.5 +150 150 +85 18 6.0 60 V V V A A C C C V V W UNIT
QUALITY SPECIFICATION Quality specification in accordance with "SNW-FQ-611D", if this type is used as an audio amplifier. THERMAL CHARACTERISTICS Thermal characteristics in accordance with IEC 60747-1. SYMBOL Rth(j-c) Rth(j-a) PARAMETER thermal resistance from junction to case thermal resistance from junction to ambient CONDITIONS see Fig.5 in free air VALUE 1.9 40 UNIT K/W K/W
2001 Apr 24
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Philips Semiconductors
Objective specification
2 x 40 W/2 stereo BTL car radio power amplifier with differential inputs and diagnostic outputs
TDA8566TH
handbook, halfpage
output 1
output 2
virtual junction
3.2 K/W
3.2 K/W
0.3 K/W
case
MGU361
Fig.5 Equivalent thermal resistance network.
DC CHARACTERISTICS VP = 14.4 V; Tamb = 25 C; measured in test circuit of Fig.6; unless otherwise specified. SYMBOL Supply VP Iq VMODE IMODE VO VOO VMODE VO VOO VOO supply voltage quiescent current mode select switch level mode select switch current output voltage output offset voltage mode select switch level output voltage output offset voltage output offset voltage difference note 1 RL = 6 - 8.5 - - - 3.3 - - - 14.4 115 - 15 7.0 - - 7.0 - - 18 180 VP 40 - 100 6.4 - 60 60 V mA V A V mV V V mV mV PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Operating condition VMODE = 14.4 V note 2
Mute condition note 2 with respect to operating condition
Standby condition VMODE Istb Diagnostic VDIAG Notes 1. The circuit is DC adjusted at VP = 6 to 18 V and AC operating at VP = 8.5 to 18 V. 2. At VP = 18 to 30 V the DC output voltage is 0.5VP. diagnostic output voltage during any fault condition - - 0.6 V mode select switch level standby current 0 - - 0.1 2 10 V A
2001 Apr 24
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Philips Semiconductors
Objective specification
2 x 40 W/2 stereo BTL car radio power amplifier with differential inputs and diagnostic outputs
TDA8566TH
AC CHARACTERISTICS VP = 14.4 V; Tamb = 25 C; RL = 2 ; fi = 1 kHz; measured in test circuit of Fig.6; unless otherwise specified. SYMBOL Po PARAMETER output power CONDITIONS THD = 0.5% THD = 10% THD = 30% VP = 13.5 V; THD = 0.5% VP = 13.5 V; THD = 10% THD = 0.5%; RL = 4 THD = 10%; RL = 4 THD = 30%; RL = 4 VP = 13.5 V; THD = 0.5%; RL = 4 VP = 13.5 V; THD = 10%; RL = 4 THD total harmonic distortion Po = 1 W VCLIP = 0.6 V; note 1 Po = 1 W; RL = 4 B fro(l) fro(h) Gv SVRR power bandwidth low frequency roll off high frequency roll off closed loop voltage gain supply voltage ripple rejection operating; note 3 mute; note 3 standby; note 3 Zi Zi Vn(o) input impedance input impedance mismatch noise output voltage operating; Rs = 10 k; note 4 mute; independent of Rs; note 4 cs Gv channel separation channel unbalance Po = 25 W; Rs = 10 k differential single-ended THD = 0.5%; Po = -1 dB with respect to 25 W -1 dB; note 2 -1 dB MIN. 25 33 45 - - 16 21 28 - - - - - - - 20 25 50 50 80 100 50 - operating; Rs = 0 ; note 4 - - - 45 - 30 40 55 25 35 19 25 35 14 22 0.1 8 0.05 TYP. - - - - - - - - - - - - - MAX. UNIT W W W W W W W W W W % % % Hz Hz kHz dB dB dB dB k k % V V V dB dB
20 to 20000 - 25 - 26 - - - 120 60 2 85 100 60 - - - - 27 - - - 150 75 - 120 - - - 1
2001 Apr 24
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Philips Semiconductors
Objective specification
2 x 40 W/2 stereo BTL car radio power amplifier with differential inputs and diagnostic outputs
SYMBOL Vo(mute) CMRR PARAMETER common mode rejection ratio CONDITIONS - 60 40 Rs = 0 ; note 5 Rs = 45 k; note 6 MIN. - 75 - TYP.
TDA8566TH
MAX. 2 - -
UNIT mV dB dB
output signal voltage in mute Vin = Vin(max) = 1 V (RMS)
Notes 1. Dynamic distortion detector active; pin CLIP is LOW. 2. Frequency response externally fixed. 3. Vripple = Vripple(max) = 2 V (p-p); Rs = 0 . 4. Noise measured in a bandwidth of 20 Hz to 20 kHz. 5. Common mode rejection ratio measured at the output (over RL) with both inputs tied together; Vcommon 3.5 V (RMS); fi = 100 Hz to 10 kHz; Rs = 0 . 6. Common mode rejection ratio measured at the output (over RL) with both inputs tied together; Vcommon 3.5 V (RMS); fi = 1 kHz; Rs = 45 k. The mismatch of the input coupling capacitors is excluded.
2001 Apr 24
9
Philips Semiconductors
Objective specification
2 x 40 W/2 stereo BTL car radio power amplifier with differential inputs and diagnostic outputs
TEST AND APPLICATION INFORMATION
TDA8566TH
handbook, full pagewidth
+ Vmode _ +8 Rs/2 220 nF 60 k 20 + - 12 19 13 + 100 nF 2200 F/16V
+V P= _ 14.4 V
Vin1 Rs/2 220 nF _9 60 k - +
TDA8566TH
15 _
RL1 VP 10 k VP 10 k CLIP
Vref + 10 +2 Rs/2 Vin2 Rs/2 220 nF _3 60 k - + 220 nF 60 k - + -
CLIP DETECTOR DIAGNOSTIC INTERFACE
11
1
DIAG
16 +
RL2 18 _ 14 17
MGU359
Fig.6 Stereo BTL test diagram.
Application information DIAGNOSTIC OUTPUT Special care must be taken in the PCB layout to separate pin CLIP from pins IN1+, IN1-, IN2+ and IN2- to minimize the crosstalk between the CLIP output and the inputs. MODE SELECT SWITCH To avoid switch-on plops, it is advisable to keep the amplifier in the mute mode during 150 ms (charging of the input capacitors at pins IN1+, IN1-, IN2+ and IN2-). The circuit in Fig.7 slowly ramps-up the voltage at the mode select switch pin when switching on and results in fast muting when switching off.
mode select switch 100 k
handbook, halfpage
+Vsupply
S
10 k
100
47 F
MGD102
Fig.7 Mode select switch circuit.
2001 Apr 24
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Philips Semiconductors
Objective specification
2 x 40 W/2 stereo BTL car radio power amplifier with differential inputs and diagnostic outputs
PACKAGE OUTLINE HSOP20: plastic, heatsink small outline package; 20 leads; low stand-off height
TDA8566TH
SOT418-2
E D x
A X
c y E2 HE vM A
D1 D2 1 pin 1 index Q A2 E1 A4 Lp detail X 20 Z e bp 11 wM (A3) A 10
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A A2 max. 3.5 3.5 3.2 A3 0.35 A4(1) bp c D(2) D1 D2 1.1 0.9 E(2) 11.1 10.9 E1 6.2 5.8 E2 2.9 2.5 e 1.27 HE 14.5 13.9 Lp 1.1 0.8 Q 1.7 1.5 v w x y Z 2.5 2.0 8 0
+0.12 0.53 0.32 16.0 13.0 -0.02 0.40 0.23 15.8 12.6
0.25 0.25 0.03 0.07
Notes 1. Limits per individual lead. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT418-2 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 98-02-25 99-11-12
2001 Apr 24
11
Philips Semiconductors
Objective specification
2 x 40 W/2 stereo BTL car radio power amplifier with differential inputs and diagnostic outputs
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 220 C for thick/large packages, and below 235 C for small/thin packages. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed.
TDA8566TH
If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
2001 Apr 24
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Philips Semiconductors
Objective specification
2 x 40 W/2 stereo BTL car radio power amplifier with differential inputs and diagnostic outputs
Suitability of surface mount IC packages for wave and reflow soldering methods
TDA8566TH
SOLDERING METHOD PACKAGE WAVE BGA, HBGA, LFBGA, SQFP, TFBGA HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. not suitable not not not suitable(2) recommended(3)(4) recommended(5) suitable REFLOW(1) suitable suitable suitable suitable suitable
2001 Apr 24
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Philips Semiconductors
Objective specification
2 x 40 W/2 stereo BTL car radio power amplifier with differential inputs and diagnostic outputs
DATA SHEET STATUS DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2) Development DEFINITIONS
TDA8566TH
This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A.
Preliminary data
Qualification
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2001 Apr 24
14
Philips Semiconductors
Objective specification
2 x 40 W/2 stereo BTL car radio power amplifier with differential inputs and diagnostic outputs
NOTES
TDA8566TH
2001 Apr 24
15
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For all other countries apply to: Philips Semiconductors, Marketing Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 2001
Internet: http://www.semiconductors.philips.com
SCA 72
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Printed in The Netherlands
753503/01/pp16
Date of release: 2001
Apr 24
Document order number:
9397 750 08125

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